Top 10 Companies in the Low-Pressure Molding Molds Industry (2025): Precision Engineering Leaders Powering Electronics and Automotive Sectors

In Business and finance, Global Business
September 12, 2025

The Global Low-Pressure Molding Molds Market was valued at USD 82 million in 2023 and is projected to reach USD 121.86 million by 2032, growing at a Compound Annual Growth Rate (CAGR) of 4.50% during the forecast period (2023-2032). This steady expansion is fueled by increasing demand for precision component encapsulation in electronics manufacturing and the automotive industry’s transition to electric vehicles.

As manufacturers prioritize miniaturization, environmental protection, and production efficiency, low-pressure molding technology has become critical for delicate component encapsulation. In this analysis, we examine the Top 10 Companies in the Low-Pressure Molding Molds Industry—technical experts delivering innovative mold designs, advanced materials, and global manufacturing solutions.


🔟 1. LPMS

Headquarters: Tokyo, Japan
Key Offering: Precision-engineered steel and aluminum molds for microelectronics

LPMS dominates the Asian market with proprietary mold designs optimized for low-pressure thermoplastic encapsulation. The company maintains strategic partnerships with leading electronics manufacturers for component protection solutions.

Technical Innovations:

  • Proprietary cooling system reducing cycle times by 18-22%
  • Integrated process monitoring sensors
  • Automotive-grade solutions for wire harness protection

Download FREE Sample Report: Low-Pressure Molding Molds Market – View in Detailed Research Report


9️⃣ 2. PT.Fuji Junya Kitagawa (PT.FJK)

Headquarters: Jakarta, Indonesia
Key Offering: Cost-optimized aluminum molds for medium production volumes

PT.FJK specializes in durable aluminum molds tailored to Southeast Asia’s manufacturing ecosystem, serving 220+ clients across multiple industries.

Technical Innovations:

  • 14-21 day prototype turnaround
  • Regional material sourcing network

8️⃣ 3. MoldMan Systems

Headquarters: Shenzhen, China
Key Offering: Modular mold systems for flexible electronics production

MoldMan Systems delivers adaptable solutions enabling manufacturers to switch between product configurations with minimal downtime.

Technical Innovations:

  • Interchangeable cavity inserts
  • AI-powered flow optimization software

7️⃣ 4. SUZHOU KONIG Electronic Technology

Headquarters: Suzhou, China
Key Offering: Ultra-precision molds for semiconductor components

Specializing in micro-scale applications, SUZHOU KONIG delivers molds with tolerances to 10μm for global chip manufacturers.

Technical Innovations:

  • Nano-surface treatments
  • Vacuum-assisted molding systems

Download FREE Sample Report: Low-Pressure Molding Molds Market – View in Detailed Research Report


6️⃣ 5. Nord

Headquarters: Milan, Italy
Key Offering: Heavy-duty steel molds for automotive applications

Nord produces durable steel molds meeting strict European automotive standards, specializing in EV battery and wiring system encapsulation.

Technical Innovations:

  • Special alloy construction
  • Precision thermal management

5️⃣ 6. Overmould Ltd

Headquarters: Birmingham, UK
Key Offering: Integrated molding systems with matched tooling

Overmould provides complete molding solutions combining optimized tooling with compatible low-pressure injection equipment.

Technical Innovations:

  • Closed-loop pressure regulation
  • Remote system monitoring

4️⃣ 7. Jinxiong

Headquarters: Dongguan, China
Key Offering: High-capacity production molds

Jinxiong focuses on cost-effective molds for mass production environments, serving electronics manufacturers requiring millions of encapsulated components.

Technical Innovations:

  • Automated tool changing
  • Predictive maintenance systems

3️⃣ 8. Precision Mold Systems

Headquarters: Chicago, USA
Key Offering: Custom-engineered molds for North American manufacturers

This U.S.-based provider specializes in rapid development cycles for domestic production needs.

Technical Innovations:

  • 3D printed verification models
  • Integrated DFM analysis

2️⃣ 9. TechMold Solutions

Headquarters: Seoul, South Korea
Key Offering: Advanced mold technology for next-gen applications

TechMold leads in developing solutions for emerging 5G and electric vehicle battery encapsulation requirements.

Technical Innovations:

  • Multi-material capabilities
  • Embedded electronics solutions

1️⃣ 10. Formatech Molding Solutions

Headquarters: Munich, Germany
Key Offering: High-specification molds for medical and aerospace

Formatech produces premium molds meeting stringent regulatory requirements for critical applications.

Technical Innovations:

  • Cleanroom-compatible designs
  • Full material traceability

Read Full Report: Low-Pressure Molding Molds Market – View in Detailed Research Report


🌍 Market Projections: Precision and Automation Driving Evolution

The low-pressure molding molds sector is undergoing significant transformation as manufacturers demand higher precision, shorter cycle times, and smarter production solutions.

📈 Critical Industry Trends:

  • Growing preference for aluminum molds in prototyping applications
  • Integration of IoT monitoring in mold systems
  • Expansion of multi-cavity mold configurations
  • Advanced surface engineering for extended tool life

Growth Opportunities in Low-Pressure Molding

  • Electric vehicle applications — Expanding EV production creates strong demand for specialized battery and wiring system molds
  • 5G technology components — Next-generation communications infrastructure requires precise RF component encapsulation
  • Medical device manufacturing — Increasing regulatory requirements drive need for compliant molding solutions
  • Industry 4.0 integration — Smart molds with embedded sensors and connectivity

Read Full Report: Low-Pressure Molding Molds Market – View in Detailed Research Report

The companies featured above represent the technical vanguard of the low-pressure molding industry, developing solutions that will protect and enable tomorrow’s electronic and automotive technologies.